Compaq SmartModule Express SMX945 Manual do Utilizador descarregar pdf (Página 14)

DIGITAL-LOGIC AG SMX945 Condensed Manual V1.0A

Physical Characteristics Specification

Dimensions Length: 117 mm +/- 0.1mm

Depth: 70 mm +/- 0.1mm

Height: 15 mm +/- 0.2mm (with 5mm bus connectors)

18 mm +/- 0.2mm (with 8mm bus connectors)

The connector height is selected by the connector on the carrier board.

Weight 120 gr / 12 ounces

PCB Thickness 1.6 mm / 0.0625 inches nominal

PCB Layer Multilayer

Operating Environment Specification

Relative Humidity 5-90% non-condensing

Vibration 5 to 2000 Hz

Shock 10 G

Operating Temperature Standard: T.B.D. (depends on the CPU and the cooling concept)

Extended Range: T.B.D.

Maximum Copper Temperature 90°C

Storage Temperature -55°C to +85°C

EMI / EMC (IEC1131-2 refer MIL

461/462)

Specification

ESD Electro Static Discharge IEC 801-2, EN55101-2, VDE 0843/0847 Part 2

Metallic protection needed

Separate Ground Layer included

15 kV single peak

REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9.

Not tested

EFT Electric Fast Transient (Burst) IEC 801-4, EN50082-1, VDE 0843 Part 4

250V - 4kV, 50 ohms, Ts=5ns

Grade 2: 1KV Supply, 500 I/O, 5Khz

SIR Surge Immunity Requirements IEC 801-5, IEEE587, VDE 0843 Part 5

Supply: 2kV, 6 pulse/minute

I/O: 500V, 2 pulse/minute

FD, CRT: None

High-Frequency Radiation EN55022

All information is subject to change without notice.

1 2 ... 9 10 11 12 13 14 15 16 17 18 19 20 21

Sem comentários

Compaq SmartModule Express SMX945 Manual do Utilizador Página 14